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data sheet may 6, 2011 estw015a0f series (eighth - brick) dc - dc converter power modules 36 C 75vdc input; 3.3vdc output; 15a output current * ul is a registered trademark of underwriters laboratories, inc. ? csa is a registered trademark of canadian standards association. ? vde is a trademark of verband deutscher elektrotechniker e.v. this product is intended for integration into end - user equipment . all of the required procedures of end - use equipment should be followed. ieee and 802 are registered trademarks of the institute of electrical and electronics engineers, incorporated. * * iso is a registered trademark of the international organization of standards document no: ds09 - 004 ver. 1. 0 3 pdf name: estw 015 a0f .pdf stingray ? series features ? compliant to rohs eu directive 2002/95/ec ( - z versions) ? compliant to rohs eu directive 2002/95/ec with lead solder exemption (non - z versions) ? delivers up to 15a output current ? high efficiency 91% at full load (vin=48v dc ) ? full load at t a =85 o c for airflow of 1 m/s(200 lfm) or greater ? industry standard, dosa compliant footprint 57.9mm x 22.8mm x 8.5mm (2.28 in x 0.9 in x 0.335 in) ? wide input voltage range: 36 - 75 v dc ? tightly regulated output ? constant switching frequency ? positive remote on/off logic ? input under voltage protection ? output overcurrent and overvoltage protection ? over - temperature protection ? remote s ense ? output voltage adjust: 80% to 110% of v o,nom ? wide operating temperature range ( - 40c to 85c) ? ul * 60950 - 1, 2 nd ed. recognized, csa ? c22.2 no. 60950 - 1 - 07 certified, and vde ? (en60950 - 1, 2 nd ed.) licensed ? ce mark meets 2006/95/ec directive ? meets the voltage and current requirements for etsi 300 - 132 - 2 and complies with and licensed for basic insulation rating per en60950 - 1 ? 2250 v dc isolation tested in compliance with ieee 802.3 poe standards ? iso ** 9001 and iso 14001 certified manufacturing facilities applications ? distributed power architectures ? wireless networks ? access and optical network equipment ? enterprise networks including power over ethernet (poe) ? latest generation ics (dsp, fpga, asic) and microprocessor powered applications options ? negative remote on/off logic ( - 1 option, preferred /standard ) ? surface mount version ( - s option ) ? auto - restart ( - 4 option, preferred/standard) ? trimmed leads ( - 6 or - 8 options) description the lineage power ? stingray ? series , estw 015 a0f , eighth - brick power modules are cost optimized isolated dc - dc converters that can deliver up to 15a of output current and provide a precisely regulated output voltage over a wide range of input voltages (vin = 36 - 75v dc ). the module achieve s full load efficiency of 9 1 % at 3.3 v dc output voltage. the open frame modules construction, available in both surface - mount and through - hole packaging, enable designers to develop cost - and space - efficient solutions. standard features include remote on/off, remote sense, output voltage adju stment, overvoltage, overcurrent and overtemperature protection . rohs compliant
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 2 absolute maximum ratings stresses in excess of the absolute maximum ratings can cause permanent damage to the device. these are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. parameter device symbol mi n max unit input voltage continuous all v in - 0.3 80 v dc transient , operational ( 100 ms) all v in,trans - 0.3 100 v dc operating ambient temperature all t a - 40 85 c (see thermal considerations section) storage temperature all t stg - 55 125 c i/o isolation voltage (100% factory hi - pot tested) all 225 0 v dc electrical specifications unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. parameter device symbol min typ max unit operating input voltage all v in 36 48 75 v dc maximum input current all i in,max 2 .0 a dc (v in = v in, min to v in, max , i o =i o, max ) input no load current all i in,no load 3 0 ma (v in = v in, nom , i o = 0, module enabled) input stand - by current all i in,stand - by 6 8 ma (v in = v in, nom , module disabled) inrush transient all i 2 t 1 a 2 s input reflected ripple current, peak - to - peak (5hz to 20mhz, 1h source impedance; v in, min to v in, max, i o = i omax ; see test configuration section) all 30 ma p - p input ripple rejection (120hz) all 50 db caution: this power module is not internally fused. an input line fuse must always be used. this power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. to preserve maximum flexibility, internal fusing is not included, however, to achieve maxi mum safety and system protection, always use an input line fuse. the safety agencies require a fast - acting fuse with a maximum rating of 5 a (see safety considerations section). based on the information provided in this data sheet on inrush energy and maxi mum dc input current, the same type of fuse with a lower rating can be used. refer to the fuse manufacturers data sheet for further information.
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 3 electrical specifications (continued) parameter device symbol min typ max unit nominal output voltage set - point v in =v in, nom , i o =i o, max , t a =25c) all v o, set 3.25 3.3 3.35 v dc output voltage all v o 3.2 3.4 v dc (over all operating input voltage, resistive load, and temperature conditions until end of life) output regulation line (v in =v in, min to v in, max ) all 0. 1 % v o, set load (i o =i o, min to i o, max ) all 10 mv temperature (t ref =t a, min to t a, max ) all 0.2 % v o, set output ripple and noise on nominal output (v in =v in, nom ,i o = i o, max , t a =t a, min to t a, max ) rms (5hz to 20mhz bandwidth) all 8 20 mv rms peak - to - peak (5hz to 20mhz bandwidth) all 40 75 mv pk - pk external capacitance all c o, max 0 5,000 f output current all i o 0 15 .0 a dc output current limit inception (hiccup mode ) all i o, lim 19 a dc (v o = 90% of v o, set ) output short - circuit current (v o 250mv) all i o, s/c 60 2. 5 a pk a avg ( hiccup mode) efficiency v in = v in, nom , t a =25c, i o =i o, max , v o = v o,set all 9 0 .0 9 1. 0 % v in = v in, nom , t a =25c, i o = 10a , v o = v o,set all 9 0 .0 9 1. 0 % v in = v in, nom , t a =25c, i o =4a , v o = v o,set all 85. 5 8 7.0 % switching frequency all f sw 355 khz dynamic load response (di o /dt=0.1a/ s; v in = v in, nom ; t a =25c) load change from io= 50% to 75% or 25% to 50% of i o,max peak deviation all v pk 2 1 0 mv settling time (vo<10% peak deviation) all t s 200 s isolation specifications parameter device symbol min typ max unit isolation capacitance all c iso 1 000 pf isolation resistance all r iso 10 m i/o isolation voltage (100% factory hi - pot tested) all all 2 25 0 v dc general specifications parameter device symbol min typ max unit calculated reliability based upon telcordia sr - 332 issue 2: method i case 3 (i o =80%i o, max , t a =40c, airflow = 200 lfm, 90% confidence) all fit 212.2 10 9 /hours all mtbf 4,713,305 hours weight all 15.2 (0.6 ) g (oz.)
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 4 feature specifications unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. see feature descriptions for additional information. parameter device symbol min typ max unit remote on/off signal interface (v in =v in, min to v in, max ; open collector or equivalent, signal referenced to v in - terminal) negative logic: device code suffix 1 logic low = module on, logic high = module off positive logic: no device code suffix required logic low = module off, logic high = module on logic low - remote on/off current ( v on/off = - 0.7 v dc ) all i on/off 0.15 ma logic low - on/off voltage all v on/off - 0.7 0.6 v dc logic high voltage (i on/off = 0a dc ) all v on/off 2.4 15.0 v dc logic high maximum leakage current all i on/off 25 a turn - on delay 1 and rise times (i o =i o, max , v in =v in, nom, t a = 25 o c) case 1: input power is applied for > 1 second a nd then the on/off input is set to on (t delay = time from instant on/off signal is on until v o = 10% of v o, set ) all t delay D 12 D msec case 2: on/off input is set to logic low (module on) and then input power is applied (t delay = time at which v in = v in, min until v o =10% of v o,set ) all t delay D 20 D msec output voltage rise time (time for v o to rise from 10% of v o,set to 90% of v o, set ) all t rise D 4 D msec output voltage overshoot C startup all D 5 % v o, set i o = i o, max ; v in =v in, min to v in, max , t a = 25 o c remote sense range all v sense 10 % v o, set output voltage adjustment range all - 20 +10 % v o, set output overvoltage protection (c o =220f) all v o, limit 3.9 5.0 v dc overtemperature protec tion C hiccup auto restart all t ref 138 o c input undervoltage lockout all v uvlo turn - on threshold 32 34.5 v dc turn - off threshold 27.5 3 0 v dc hysteresis 1 2 v dc 1. the module has an adaptable extended turn - on delay interval, t delay , of 25ms. the extended t delay will occur when the module restarts following either: 1) the rapid cycling of vin from normal levels to less than the input undervoltage lockout (which causes module shutd own), and then back to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. the normal turn - on delay interval, t delay , will occur whenever a module restarts with input voltage removed from the module for the preceding 1 second.
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 5 characteristic curves the following figures provide typical characteristics for the estw 015a0f ( 3.3v , 15 a) at 25 o c. the figures are identical for either positive or negative remote on/off logic. efficiency, (%) output current output voltage io(a) ( 5 a/div) v o (v) ( 2 00mv/div) output current, i o (a) time, t (200 s/div) figure 1 . converter efficiency versus output current. figure 4 . transient response to 0.1 a/ s dynamic load change from 50% to 75% to 50% of full load. output voltage v o (v) (20mv/div) on/off voltage output voltage v o (v) ( 2 v/div) v on/off (v) ( 1 v/div) time, t ( 2 s/div) time, t ( 1 0 ms/div) figure 2 . typical output ripple and noise (v in = v in,nom , i o = i o,max ). figure 5 . typical start - up using remote on/off, negative logic version shown (v in = v in,nom , i o = i o,max ). output current output voltage io(a) ( 5 a/div) v o (v) ( 2 00mv/div) input voltage output voltage v o (v) ( 20v/div v in (v) ( 1 v/div) time, t ( 200 s/div) time, t ( 5 ms/div) figure 3 . transient response to 0.1a/ s dynamic load change from 25 % to 50 % to 25 % of full load. figure 6 . typical start - up using input voltage (v in = v in,nom , i o = i o,max ).
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 6 test configurations figure 7 . input reflected ripple current test setup. figure 8 . output ripple and noise test setup. figure 9 . output voltage and efficiency test setup. design considerations input filtering the power module should be connected to a low ac - impedance source. highly inductive source impedance can affect the stability of the power module. for the test configuration in figure 7 a 33f electrolytic capacitor (esr<0. 7 at 100khz), mounted close to the power module helps ensure the stability of the unit. consult the factory for further application guidelines. safety considerations for safety - agency approval of the system in which the power module is used, the power module must be installed in complia nce with the spacing and separation requirements of the end - u se safety agency standard, i.e. ul60950 - 1, csa c22.2 no.60950 - 1, and vde0805 - 1(iec60950 - 1) . if the input source is non - selv (elv or a hazardous voltage greater than 60 vdc and less than or equal to 75vdc), for the modules output to be considered as meeting the requirements for safety extra - low voltage (selv), all of the following must be true: ? the input source is to be provided with reinforced insulation from any other hazardous voltages, includi ng the ac mains. ? one v in pin and one v out pin are to be grounded, or both the input and output pins are to be kept floating. ? the input pins of the module are not operator accessible. ? another selv reliability test is conducted on the whole system (combinati on of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the modules output. note: do not ground either of the input pins of the module without grounding one of t he output pins. this may allow a non - selv voltage to appear between the output pins and ground. the power module has extra - low voltage (elv) outputs when all inputs are elv. all flammable materials used in the manufacturing of these modules are rated 94v - 0 , or tested to the ul60950 a.2 for reduced thickness. for input voltages exceeding C 60 vdc but less than or equal to C 75 vdc, these converters have been evaluated to the applicable requirements of basic insulation between secondary dc mains distribution in put (classified as tnv - 2 in europe) and unearthed selv outputs. the input to these units is to be provided with a maximum 5 a fast - acting fuse in the ungrounded lead. to oscilloscope current probe l test 12h battery c s 220f e.s.r.<0.1 @ 20c 100khz 33f vin+ vin - note: measure input reflected ripple current with a simulated source inductance (l test ) of 12h. capacit or c s offsets possible battery impedance. measure current as shown above. note: all voltage measurements to be taken at the module terminals, as shown above. if sockets are used then kelvin connectio ns are required at the module terminals to avoid measurement errors due to socket contact resistance. v o (+) v o ( C ) 0.01uf resistive load scope copper strip ground plane 10uf 0.1uf vout+ vout - vin+ vin - r load r contact r distribution r contact r distribution r contact r contact r distribution r distribution v in v o note: all voltage measurements to be taken at the module terminal s, as shown above. if sockets are used then kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. = v o . i o v in . i in x 100 % efficiency
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 7 feature description remote on/off two remote on/off options are available. positive logic turns the module on during a logic high voltage on the on/off pin, and off during a logic low. negative logic remote on/off, device code suffix 1, turns the module off during a logic high and on during a logic low. figure 1 0 . remote on/off implementation. to turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (v on/off ) between the on/off terminal and the v in ( - ) terminal (see figure 1 0 ). logic low is - 0 .7 v v on/off 0.6 v. the maximum i on/off during a logic low is 0. 1 5 ma, the switch should maintain a logic low level while sinking this current. during a logic high, the typical maximum v on/off generated by the module is 15 v , and the maximum allowable lea kage current at v on/off = 2.4 v is 25 a. if not using the remote on/off feature: for positive logic, leave the on/off pin open. for negative logic, short the on/off pin to v in ( - ). remote sense remote sense minimizes the effects of distribution losses by regulating the voltage at the remote - sense connections (see figure 1 1 ). the voltage between the remote - sense pins and the output terminals must not exceed the out put voltage sense range given in the feature specifica tions table: [v o (+) C v o ( C )] C [sense(+) C sense( C )] 0.5 v although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. the maximum incre ase is the larger of either the remote sense or the trim. the amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. when using remote sense and trim, the output voltage of the module ca n be increased, which at the same output current would increase the power output of the module. care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (maximum rated power = vo,set x io,max). figure 1 1 . circuit configuration for remote sense . input undervoltage lockout at input voltages below the input undervoltage lockout limit, the module operation is disabled. the module will only begin to operate once the input voltage is raised above the undervoltage lockout turn - on threshold, v uv/on . once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn - off threshold, v uv/off . overtemperature protection to provide protection under overte mperature fault conditions, the unit is equipped with a thermal shutdown circuit. the unit will shutdown if the thermal reference point s tref x (figure 1 3 ), exceed 138 o c (typical). however, the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. the module restarts automatically after the unit cools down below the overtemperature protection thresholds. output overvoltage protection the outp ut over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. this protection feature latches in the event of over voltage across the output. cycling the on/off pin or input voltage resets the l atching protection feature. if the auto - restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing. overcurrent protection to provide protection in a fault (output overload) condition, the unit is equip ped with internal current limiting circuitry and can endure current limiting continuously. at the point of current limit inception, the unit enters hiccup mode. if the unit is not configured with auto C restart, then it will latch off following the over current condition. the module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. if the unit is configured with the on/off vin+ vin - i on/off v on/off vout+ trim vout - v o (+) sense(+) sense( C ) v o ( C ) v i (+) v i (-) i o lo ad c ont ac t an d d istribution losses suppl y i i cont ac t r esist a nce
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 8 feature descriptions (continued) auto - restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back into its specified range. the average output current during hiccup is 10% i o, max . output voltage programming trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external resistor between the trim pin and either the v o (+) pin or the v o ( - ) pin (figure 12) . figure 1 2 . circuit configuration to trim output voltage. connecting an external resistor (r trim - down ) between the trim pin and the v o ( - ) (or sense( - )) pin decreases the output voltage set point. to maintain set point accuracy, the trim resistor tolerance should be 1.0%. the following equation determines the required external resistor value to obtain a percentage output voltage change of % where for example, to trim - down the output voltage of the module by 8% to 3.036 v, rtrim - down is calculated as follows: connecting an external resistor (r trim - up ) between the trim pin and the v o (+) (or sense (+)) pin increases the output voltage set point. the followin g equation determine s the required external resistor value to obtain a percentage output voltage change of %: where for example, to tri m - up the output vol tage of the module by 5% to 3.465 v, r trim - up is calculated is as follows: the voltage between the v o (+) and v o ( C ) terminals must not exceed the minimum output overvoltage protection value shown in the feature specifications table. this limit includes any increase in voltage due to remote - sense compensation and output voltage set - point adjustment trim. although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. the maximum increase is the larger of either the remote sense or the trim. t he amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. when using remote sense and tri m, the output voltage of the mod ule can be increased. therefore, f or the same output current , this would increase the output power of the module. care should be taken to ensure that the maximum output power of the module remains at or below the maximum rat ed power (maximum rated power = v o ,set x i o ,max ). v o (+) v o trim v o ( - ) r trim - down load v in (+) on/off v in ( - ) r trim - up 22 . 10 % 511 down trim r 100 % , , set o desired set o v v v 8 % 22 . 10 8 511 down trim r 655 . 53 down trim r 22 . 10 % 511 % 225 . 1 %) 100 ( 11 . 5 , set o up trim v r 100 % , , set o set o desired v v v 5 % 22 . 10 5 511 5 225 . 1 ) 5 100 ( 3 . 3 11 . 5 up trim r 7 . 176 up trim r
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 9 thermal considerations the power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. considerations include ambient tem perature, airflow, module power dissipation, and the need for increased reliability. a reduction in the operating temperature of the module will result in an increase in reliability. the thermal data presented here is based on physical measurements taken in a wind tunnel. the thermal reference point s , t ref x used in the specifications for open frame modules are shown in figure 1 3 . for reliable operation t ref 1 and t ref 2 temperature s should not exceed 1 25 o c and t ref 3 temperature should not exceed 110 o c . figure 1 3 . t ref te mperature measurement location for o pen frame module . heat transfer via convection increased airflow over the module enhances the heat transfer via convection. derating curves , showing the maximum output current that can be delivered by the module versus local ambient temperature (t a ) fo r natural convection and up to 1m/s (2 00 ft./min) forced airflow , are shown in figure 1 4 . full power up to t a =85 o c , is achieved for airflow of 1 m/s(200 lfm) or greater. output current, i o (a) ambient temeperature, t a ( o c ) figure 1 4 . output current derating for the open frame module; airflow in the transverse direction from vout(+) to vout( - ); vin =48v . please refer to the application note thermal characterization process for open - frame board - mounted power modules for a detailed discussion of the thermal aspects including maximum device temperatures. 10 11 12 13 14 15 16 20 30 40 50 60 70 80 90 nc 0.5m/s (100lfm) 1.0m/s (200lfm)
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 10 surface mount information pick and place the estw 015a0f modules use an open frame construction and are designed for a fully automated assembly process. the modules are fitted with a label designed to provide a large surface area for pick and place operations. the label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300 o c. the label also carries product information such as product code, serial number and the location of manufacture. figure 1 5 . pick and place location. nozzle recommendations the module weight has been kept to a minimum by using open frame construction. even so, these modules have a relatively large mass when compared to conventional smt components. variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. the minimum recommended nozzle diameter for reliable operation is 6mm. the maximum nozzle outer diameter, which will safely fit within the allowable compo nent spacing, is 9 mm. oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. tin lead soldering the estw 015a0f power modules are lead free modules and can be soldered either in a lead - free solder process or in a conventional tin/lead (sn/pb) process. it is recommended that the customer review data sheets in order to customize the solder reflow profile for each ap plication board assembly. the following instructions must be observed when soldering these units. failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long - term reliability. in a conv entional tin/lead (sn/pb) solder process peak reflow temperatures are limited to less than 235 o c. typically, the eutectic solder melts at 183 o c, wets the land, and subsequently wicks the device connection. sufficient time must be allowed to fuse the plat ing on the connection to ensure a reliable solder joint. there are several types of smt reflow technologies currently used in the industry. these surface mount power modules can be reliably soldered using natural forced convection, ir (radiant infrared), or a combination of convection/ir. for reliable soldering the solder reflow profile should be established by accurately measuring the modules cp connector temperatures. reflow temp ( c) reflow time (s) figure 1 6 . reflow profile for tin/lead (sn/pb) process. max temp solder ( c) figure 17 . time limit curve above 205 o c for tin/lead (sn/pb) process lead free soldering the C z version of the estw 015a0f modules are lead - free (pb - free) and rohs compliant and are both forward and backward compatible in a pb - free and a snpb soldering process . failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long - term reliability. reflow soldering information the surface mountable modules in the estw015a0f - s family use our newest smt technology called column pin (cp) connectors.
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 11 surface mount information (continued) figure 18 shows the new cp connector before and after reflow soldering onto the end - board ass embly. figure 18 . column pin connector before and after reflow soldering . the cp is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (sn 63 /pb 37 ) solder for non - z codes, or sn/ag 3.8 /cu 0.7 (sac) solder for C z codes. the cp connector design is able to compensate for large amounts of co - planarity and still ensure a reliable smt solder joint. typically, the eutectic solder melts at 183 o c (sn/pb solder) or 217 - 218 o c (sac solder) , wets the land, and subsequently wicks the device connection. sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. there are several types of smt reflow technologies currently used in the industry. the se surface mount power modules can be reliably soldered using natural forced convection, ir (radiant infrared), or a combination of convection/ir. pb - free reflow profile power systems will comply with j - std - 020 rev. c (moisture/reflow sensitivity classific ation for nonhermetic solid state surface mount devices) for both pb - free solder profiles and msl classification procedures. this standard provides a recommended forced - air - convection reflow profile based on the volume and thickness of the package (table 4 - 2). the suggested pb - free solder paste is sn/ag/cu (sac). the recommended linear reflow profile using sn/ag/cu solder is shown in fig ure 19 . msl rating the estw 015a0f modules have a msl rating of 1 . storage and handling the recommended storage environment and handling procedures for moisture - sensitive surface mount packages is detailed in j - std - 033 rev. a (handling, packing, shipping and use of moisture/reflow sensitive surface mount devices). moisture barrier bags (mbb) with desiccant are required for msl ratings of 2 or greater. these sealed packages should not be broken until time of use. once the original package is broken, the floor life of the product at conditions of 30c and 60% relative humidity varies accord ing to the msl rating (see j - std - 033a). the shelf life for dry packed smt packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40 c, < 90% relative humidity. post solder cleaning and drying considera tions post solder cleaning is usually the final circuit board assembly process prior to electrical board testing. the result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit board assembly. for guidance on appropriate soldering, cleaning and drying procedures, refer to lineage power board mounted power modules: soldering and cleaning application note (an04 - 001). figure 19 . recommended linear reflow profile using sn/ag/cu s older. through - hole lead - free soldering information the rohs - compliant through - hole products use the sac (sn/ag/cu) pb - free solder and rohs - compliant components. they are designed to be processed through single or dual wave soldering machines. the pins have a rohs - compliant finish that is compatible with both pb and pb - free wave soldering processes. a maximum preheat rate of 3 c/s is suggested. the wave preheat process should be such that the temperature of the power module board is kept below 210 c. for pb solder, the recommended pot temperature is 260 c, while the pb - free solder pot is 270 c max. not all rohs - compliant through - hole products can be processed with paste - through - hole pb or pb - free reflow process. if additional information is needed, p lease consult with your lineage power representative for more details. e st w board insulator solder ball end assembly pcb per j-std-020 rev. c 0 50 100 150 200 250 300 reflow time (seconds) reflow temp (c) heating zone 1c/second peak temp 260c * min. time above 235c 15 seconds *time above 217c 60 seconds cooling zone
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 12 emc considerations the filter circuit schematic and plots in figure 2 0 shows a suggested configuration as tested to meet the conducted emission limits of en55022 class a . note: customer is ultimately responsible for the proper selection, component rating and verification of the suggested parts based on the end application. lisn connected to l line lisn connected to n line figure 2 0 . emc considerations for further information on designing for emc compliance, please refer to the flt007a0 data sheet (ds05 - 028). c1 l1 c2 c3 c4 c5 dc/dc c6 + + -48v rtn gnd vcc gnd load
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 13 mechanical outline for through - hole module dimensions are in millimeters and [inches]. tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] top view* top side label includes lineage power name, product designation and date code. side view *for optional pin lengths, see table 2, device options bottom view pin function 1 vi(+) 2 on/off 3 vi( - ) 4 vo( - ) 5 sense( - ) 6 trim 7 sense(+) 8 vo(+)
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 14 mechanical outline for surface mount module dimensions are in millimeters and [inches]. tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] top view * * top side label includes lineage power name, product designation and date code. side view bott o m view pin function 1 vi(+) 2 on/off 3 vi( - ) 4 vo( - ) 5 sense( - ) 6 trim 7 sense(+) 8 vo(+)
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 15 recommended pad layout dimensions are in millimeters and [inches]. tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] smt recommended pad layout (component side view) th recommended pad layout (component side view)
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output lineage power 16 packaging details the surface mount versions of the estw 015a0f modules (suffix C s) are supplied as standard in the plastic tray shown in figure 21 . the tray has external dimensions of 135.1mm(w) x 321.8mm (l) x 12.42mm(h) or 5.319in(w) x 12.669in(l) x 0. 489in(h). tray specification material antistatic coated pvc max surface resistivity 10 12 /sq color clear capacity 12 power modules min order quantity 48 pcs (1 box of 4 full trays) each tray contains a total of 12 power modules. the trays are self - stacking and ea ch shipping box will contain 4 full trays plus one empty hold down tray giving a total number of 48 power modules. figure 2 1 . surface mount packaging tray.
data sheet may 6, 2011 e st w015 a0f series eighth - brick power modules 36 C 75vdc input; 3.3 vdc output; 15a output document no: ds09 - 004 ver. 1. 0 3 pdf name: estw015a0f .pdf ordering information please contact your lineage power sales representative for pricing, availability and optional features. table 1. device code s product c odes input voltage output voltage output current on/off logic connector ty pe comcodes estw 015a0f 61 48v (36 - 75vdc) 3.3v 1 5 a negative through hole cc 10 9158093 estw 015a0f641 48v (36 - 75vdc) 3.3v 15a negative through hole cc 10 9158102 estw 015a0f41z 48v (36 - 75vdc) 3.3v 15a negative through hole cc109158085 estw 015a0f 641 - z 48v (36 - 75vdc) 3.3v 15a negative through hole cc10915 9942 estw 015a0f41 - sz 48v (36 - 75vdc) 3.3v 15a negative surface mount cc10915 9422 table 2. d evice options

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